When low cost meets top quality

Bond-1® is the simple-to-use 5th generation single bottle bonding system from Pentron®. With years of clinical success since its launch in 1996, Bond-1® receives top ratings in numerous independent Evaluations.



Professionals agree:

“Bond-1® is highly effective in forming a hybrid zone and preventing post-operative sensitivity and minimizing microleakage.”

Dr. Karl Leinfelder, D.D.S., M.S. (Data on file)


“Bond-1® exhibits high bond strengths to all current materials, up to 31 MPa.”

Dr. J. Powers, University of Texas (Data on file)

Bond-1® delivers an unsurpassed set of advantages

The combination of proven dentin adhesives (PMGDM, HEMA) in an acetone carrier provides:

  • Superior penetration of the bonding resin into the dentinal tubules and hybrid layer
  • A strong bond because of an intimate contact between resin and tooth structure
  • Virtuly elimination of post-operative sensitivity
  • Faster air drying after application of Bond-1®
  • Minimization of microleakage


Bond-1® is not a filled bonding resin. In addition to superior penetration, this ensures a lower film thickness (5 microns), allowing for a wider range of applications.



Bond-1® has several applications:

  • It is suitable for all direct restorations
  • It will cure in indirect applications when used in conjunction with Pentron® resin cements
  • It is ideal for bonding non-retentive posts and crowns
  • It is indicated for bonding amalgams when used in conjunction with AmalgaCure®
  • It is ideal for bonding fiber post technology (like DT POST®) in conjunction with Cement-It!® Universal C&B

Bond-1® accessories

  • 22 Gauge Bent Needle Tip (100 pk)
  • 22 Gauge Bent Needle Tip (50 pk)

Properties: Bond strength (MPa)

Moist dentin: 31.0
Lute-It!® Dual-cure cement: 36.8 (12.15)
Rexillium III (non-precious metal): 28.0 (4.8)
Naturelle (semi-precious metal): 20.9 (4.2)
RxC (gold-precious metal): 18.0 (4.1)



Ingredients

Etchants: Phosphoric acid, non-silicate based, water-soluble polymer thickening agent
Primer/Adhesive: PMGDM, HEMA, light curing initiator, and acetone
Water compatibility: Hydrophilic
Light curing: 10 seconds



Bond-1® FAQ

Q. For Dentin/Enamel bonding, which strength of acid should I use?

A. You can use either 10% or 37% phosphoric acid to etch both dentin and enamel. The Bond-1 Primer/Adhesive System was designed to give you the maximum flexibility in your etching procedure. Therefore, if you prefer a less concentrated solution choose the 10% acid. As long as the contact time is appropriate, your etching technique will not affect bond strength.


Q. Is Bond-1 Primer/Adhesive compatible with all brands of composite?

A. Yes.


Q. Should I leave the dentin moist after it has been etched?

A. Yes. Bond-1 Primer/Adhesive is hydrophilic and works best on moist dentin.


Q. What is the film thickness of Bond-1 Primer/Adhesive once it is light-cured?

A. Bond-1 Primer/Adhesive results in a film thickness of 8 microns when cured.


Q. What are the bond strengths of Bond-1 Primer/Adhesive to dentin and enamel?

A. The bond strength to dentin is 31 MPa, and to enamel is 27 MPa.


Q. How should I store Bond-1 Primer/Adhesive?

A. For maximum shelf life, store Bond-1 Primer/Adhesive in the refrigerator.
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