A Classic A+B Bonding System

Bond-It System is a 4th generation total-etch bonding system that offers a reliable technique proven over time. It is a perfect choice for dual and self cure composites and bonding under amalgam. The familiar technique and chemistry assures the ideal surface to which any restorative material may be bonded - direct or indirect composite, porcelain, metal, and amalgam alloy.

Product benefits:

  • High bond strength to dentin (29.4 MPa*)
  • Bonds to all surfaces
  • Easy to use, familiar and reliable system
  • Proven technique over years of clinical use
  • Kit contains all components to achieve bonding success
  • Ideal for bonding under amalgam


Bond-It!® can be used with any direct composite or resin luting system for all of the following applications:

  • Bonding composite restorations
  • Bonding amalgam
  • Desensitizing exposed dentin
  • Bonding and desensitizing under PFM restorations and temporaries
  • Bonding porcelain veneers, crowns and bridges
  • Bonding non-retentive restorations
  • Porcelain repair

References from experts:

“A proven system that allows the clinician to bond together virtually any combination of tooth surface, composite, porcelain, and metal.”

Karl Leinfelder D.D.S., M.S.

An abstract demonstrated that “Bond-It is capable of penetrating into both the dentin tubules and inter-tubular dentinal structure with depths of 20 to 30µm,. from the bonding interface.”

Dr. Yiming Li.,T.Noblitti, Gonzales-Cabezas, Leinfelder and others.

Bond-It!® received the rating “excellent or good” from this publication. 80% of the dentists who Evaluated it recommended its purchase.*

Bowen Formulation Resin Adhesive With Significantly Less Cost: Clinical Reasearch Associates Newsletter. Vol. 19, #7.: Utah. July 1995.

*Data on file

++++1/2 out of 5

“Bond-It!® is a highly recommended light and dual-cured adhesive for bonding composites and amalgams. It received a 91% approval rating. Bond-It!® is well packaged and easy to dispense. The instructions are clear and the product is easy to use. All Evaluators especially approved of the lower cost of Bond-It!®, as well as the high bond strength to enamel and dentin. Several commented positively on the ability of Bond-It!® to seal dentin and reduce sensitivity.”

The Dental Advisor Plus*: Vol. 6, #2: March/April 1996.

*Independent product Evaluation groups

Bond-it!® FAQ

Q. What strength of acid etch should I use for etching dentin and enamel?

A. The Bond-It Kit is designed to give you maximum flexibility for your etching procedures. We provide 37% and 10% phosphoric acid etch in the Bond-It kit. If you prefer a less concentrated solution, choose the 10% acid etch. As long as the contact time is appropriate, your etching technique will not affect bond strength.

Q. How many layers of Primer A & B do I have to apply for a shiny surface?

A. We suggest 5 applications to assure total coverage of Primer A & B on dentin. Most of the time, 3 coats are sufficient. If a shiny surface does not appear after 3-5 coats, keep applying until it does.

Q. Is the Bond-It system compatible with all brands of composite?

A. Yes.

Q. Can I apply Primer A & B onto etched enamel?

A. Yes.

Q. When bonding amalgam to tooth structure, do I allow the adhesive resin to cure first?

A. No. Apply a mixture of Bond-It Resin – Light Cure and Dual Cure Activator onto primed dentin then apply and condense amalgam immediately. For proper timing, begin trituration prior to resin application.

Q. Can I bond composite to existing amalgam with the Bond-It bonding system?

A. Yes. Roughen and clean the amalgam surface. Acid etch enamel where applicable. Cover amalgam with a mixture of Primer A & B. Dry. Apply Bond-It Resin Light Cure and Dual Cure Activator and light cure. Add composite and cure as usual.

Bond-It!® accessories

  • 22 Gauge Bent Needle Tip (100 pk)
  • 22 Gauge Bent Needle Tip (50 pk)
stik se 1 Single bottle self-etch adhesive
stik se Zero postoperative sensitivity
ena bond Can be Use as a 5th or 4th gen. bonding
bond-1 5th generation single bottle bonding
bond-it 4th generation bonding system
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